Xmega128a4u BO Testplan: Unterschied zwischen den Versionen
Tesla (Diskussion | Beiträge) KKeine Bearbeitungszusammenfassung |
Tesla (Diskussion | Beiträge) Keine Bearbeitungszusammenfassung |
||
| Zeile 1: | Zeile 1: | ||
This is the explanation how to test the Xmega128a4u breakout board in mass production process. | This is the explanation how to test the Xmega128a4u breakout board in mass production process. | ||
* All pins on the two 20-pin connectors | * All pins on the two 20-pin connectors are tested against short circuit or open connection. | ||
* The crystal | * The crystal is testet by starting the crystal oscillator. | ||
* LEDs are optically tested. | |||
* USB connector is testet against short circuit and open connection. | |||
* USB ESD protection is testet: BAS70 diode forward voltage, Z-diode breakdown voltage | |||
* Reference voltage capacitors are tested. | |||
Version vom 11. Oktober 2013, 10:08 Uhr
This is the explanation how to test the Xmega128a4u breakout board in mass production process.
- All pins on the two 20-pin connectors are tested against short circuit or open connection.
- The crystal is testet by starting the crystal oscillator.
- LEDs are optically tested.
- USB connector is testet against short circuit and open connection.
- USB ESD protection is testet: BAS70 diode forward voltage, Z-diode breakdown voltage
- Reference voltage capacitors are tested.